Rao R. Tummala

Dr. Rao Tummala is a chair professor and director of the Microsystems Packaging Center at the Georgia Institute of Technology. The author of all three volumes of Microelectronics Packaging Handbook, the best-selling reference that defines the entire field, he is an electronics and materials engineer and an experienced designer of microelectronics. Dr. Tummala was a longtime packaging technologist and IBM Fellow at IBM.