Fundamentals of device and systems packaging: technologies and applications, second edition introduces the concept of moore’s law for packaging, as moore’s law for ICs is coming to an end due to physical, material, electrical, and financial limitations. Moore’s law for packaging (mlp) can be viewed as interconnecting and integrating many smaller chips with high Aggregate transistor density, at higher performance and lower cost than moore’s law for ICs. This thoroughly revised book offers the latest, comprehensive fundamentals in device and systems packaging technologies and applications. Readers will get in-depth explanations of the 15 core packaging technologies that make up any electronic system, including electrical design for power, signal, and emi; thermal design by conduction, Convection, and radiation heat transfer; thermo-mechanical failures and reliability; advanced packaging materials at micro and mesoscale; ceramic, Organic, glass, and Silicon substrates. This resource also discusses passive components such as capacitors, inductors, and resistors and their proximity integration with activities; chip-to-package interconnections and assembly; wafer and panel embedding technologies; 3D packaging with and without TS; RF and millimeter-wave packaging; role of optoelectronic; MEMS and sensor packaging; encapsulation, moulding and sealing; and printed Wiring Board and its assembly to form end-product systems.